Wire Bonding of Infrared Detector Based on Shock Response Spectrum

Cooled infrared detectors are widely used in the fields of intelligent optoelectronic equipment because of their fast response, high sensitivity, and wide range of detectors. However, the shock response will be caused by impact excitation in practical application scenarios. To ensure competency of a cooled infrared detector in a variety of complex and changeable harsh environments, it is necessary to study the adaptability of the shock response spectrum environment in the design stage. Based on the dynamics environment in the application, the loop force and displacement of the wire were analyzed through calculation and simulation, and the characteristics of materials were considered. The bonding wire materials and bonding wire loop were designed, wire bonding process was optimized, and finally, they passed the test of a shock response spectrum of 1000g.