ZHANG Guo-dong, GONG Qi-bing, SU Hong-yi, WANG Hai-zhen, ZHENG Ke-lin. Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications[J]. Infrared Technology , 2006, 28(3): 125-128. DOI: 10.3969/j.issn.1001-8891.2006.03.001
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Citation:
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ZHANG Guo-dong, GONG Qi-bing, SU Hong-yi, WANG Hai-zhen, ZHENG Ke-lin. Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications[J]. Infrared Technology , 2006, 28(3): 125-128. DOI: 10.3969/j.issn.1001-8891.2006.03.001
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ZHANG Guo-dong, GONG Qi-bing, SU Hong-yi, WANG Hai-zhen, ZHENG Ke-lin. Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications[J]. Infrared Technology , 2006, 28(3): 125-128. DOI: 10.3969/j.issn.1001-8891.2006.03.001
|
Citation:
|
ZHANG Guo-dong, GONG Qi-bing, SU Hong-yi, WANG Hai-zhen, ZHENG Ke-lin. Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications[J]. Infrared Technology , 2006, 28(3): 125-128. DOI: 10.3969/j.issn.1001-8891.2006.03.001
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